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High light density flip high power cob led, this product USES no gold wire packaging, at the same time has the advantages of high central light intensity, uniform light output, high reliability, the size of the product is compatible with the commercial bracket and lens on the market and other related kits. It overcomes the disadvantage that the voltage of the formal chip increases sharply with the increase of the input current and is prone to burn out. At the same time, it can provide more uniform light output effect and higher optical density per unit area. At the same time, the product USES high thermal conductivity and high insulation substrate material, full heat dissipation capacity is more excellent.

COB (Chips on Board), is a new technology of LED packaging for LED light engine. Multi LED chips are packaged together as one lighting module.  COB LEDs are basically multiple LED chips (typically nine or more) bonded directly to a substrate by the manufacturer to form a single module. Since the individual LEDs used in a COB are chips and not traditionally packaged, the chips can be mounted such that they take up less space and the highest potential of the LED chips can be obtained. When the COB LED package is energized, it appears more like a lighting panel than multiple individual lights as would be the case when using several SMD LEDs mounted closely together.